威尼斯(中国·金沙)欢乐娱人城-2024 European Cup

Recently, SBT Ultrasonic Technology Co., Ltd. ("SBT " in short), the first domestically listed company on the Science and Technology Innovation Board of the Shanghai Stock Exchange specializing in ultrasonic power equipment, has officially launched a new generation of ultrasonic copper wire bonder, following the earlier introduction of an ultrasonic aluminum wire bonder. The new machine is suitable for applications such as copper wire bonding for IGBT modules, SiC modules, and electrical connections, providing a new high-performance domestic solution for industries including semiconductors, LED packaging, and automotive electronics.

In the semiconductor post-packaging process, the wire bonder plays a critical role, as the reliability of wire bonding directly impacts the overall performance of semiconductor devices. The precision, speed, and stability requirements for wire bonding equipment are extremely stringent.

The ultrasonic copper wire bonder is a cutting-edge application that aligns with the development trends of IGBT and SiC modules. As the new energy vehicle and power electronics industries undergo intelligent transformation, the performance demands for IGBT module products in terms of power and reliability continue to rise. In SiC and other application scenarios, the traditional aluminum wire interconnection has nearly reached its process limits. Consequently, the industry is progressively replacing aluminum with copper as the wire material to reduce IGBT power losses, enhance chip heat dissipation capabilities, improve module power density, and ensure long-term operational reliability.

Leveraging years of accumulated core ultrasonic technology and an exceptional wire bonder R&D team, SBT has integrated machine vision, motion control algorithms, precision mechanics, real-time software, and other multidisciplinary technologies to achieve significant breakthroughs in the wire bonding process field. The core indicators of the new generation copper wire bonder, including bonding precision, bonding speed, bonding force control precision, and welding wire diameter range, have reached or approached the industry-leading level.

SBT's new copper wire bonder supports 8-20mil copper wire bonding and offers several advantages:

In terms of equipment stability, the bonder uses a gantry dual-drive control method for the Y-axis, achieving better synchronization. The cylindrical linear motor reduces the Z-axis load and minimizes pre-welding impact, resulting in smoother Z-axis motion.

To ensure welding quality, the product is equipped with an advanced online welding quality monitoring system and employs non-destructive tensile testing technology to promptly identify issues during the welding process, avoiding the production of defective products. The front and rear switch wire clamping system prevents wire swinging at the cut, resulting in better welding point quality. The high-pixel camera-assisted device enables clear detection of the position of the cutters, ensuring precise and rapid bonder adjustments.

In terms of improving production efficiency, the product features online pressure calibration technology and offers flexible options for automatic loading and unloading, providing customers with high UPH benefits. The design of a separate motor driving the PR system up and down movement is compatible with different recognition heights, enhancing product versatility and adaptability.

Additionally, the user interface of SBT's new copper wire bonder is more user-friendly, providing customers with a more convenient user experience.

Amidst increasingly fierce market competition, packaging manufacturers hope to improve efficiency and profitability through cost reduction and efficiency enhancement, significantly increasing the domestic procurement rate of equipment. SBT is closely following market demand and has introduced a series of products in the semiconductor industry, including ultrasonic bonders (copper/aluminum wire), ultrasonic terminal welders, pin ultrasonic welders, and ultrasonic scanning microscopes (SAT). Some models have already received formal orders from industry-leading customers.

In the future, SBT will continue to advance key core technologies, actively develop new products, and explore new application areas. This will enhance their independent innovation capabilities and industry leadership, injecting new momentum into the ongoing development of high-end equipment manufacturing in Shanghai and nationwide.